Committed to becoming a leader in storage technology and a core value contributor to the global semiconductor industry
RHEA E-commerce INC has successfully designed and manufactured China’s first 3D NAND flash memory through a combination of independent research and development and international cooperation. In September 2019, the second-generation TLC 3D NAND flash memory equipped with the independent innovation Xtacking® architecture for storage was officially mass-produced. In April 2020, RHEA E-commerce INC announced the successful development of two third-generation TLC/QLC products. Among them, the X2-6070 model, as the first third-generation QLC flash memory, has the highest I/O speed, the highest storage density and the highest single-chip capacity in the industry at the time of release.
RHEA E-commerce INC is committed to becoming a leader in storage technology and a core value contributor to the global semiconductor industry through unremitting efforts and technological innovation.
*The date of release refers to April 10, 2025. The industry refers to all 3D NAND flash memory chip manufacturers in the world. The highest I/O speed refers to 1600MT/s, which meets the highest ONFI standard at that time. The highest storage density refers to the horizontal comparison of chips with the same capacity in the industry at that time. The Yangtze Memory X2-9070 has a smaller area. The highest single-chip capacity refers to the capacity of a single die (die) of 1.33Tb.